Fr4 Copper Clad Laminate Sheet

High-Performance Fr4 Copper Clad Laminate Sheet for Advanced PCB Manufacturing Solutions

For precision electronics manufacturing, J&Q New Composite Materials Company provides industrial grade Fr4 Copper Clad Laminate Sheet. Our copper clad laminates are reinforced with E-glass fabric coupled with flame retardant epoxy resin and electrolytic copper foil. Two production lines of our copper clad laminates cover an area of 96,667 square meters with an annual capacity of 43,000 tonnes. The thickness is 0.2mm-3.2mm and the normal size is 1040mm×1240mm. The dielectric strength and the dimensional stability of every product are identical. Our manufacturing method is vertically integrated and utilises modern thermal compressors and dedicated vertical resin coat equipment to ensure the batch-to-batch homogeneity necessary for high density circuit board applications.

Superior Material Composition and Construction

Our copper clad laminates are produced by combining woven E-glass fabric and high purity copper foil thru regulated lamination procedures. The substrate has excellent mechanical stiffness and has low moisture absorption < 0.15 %.

The production process starts with the precise alignment of the fibres. Glass fabric is sent thru automated resin impregnation devices for the even dispersion of epoxy. Copper foil layers (1oz, 2oz, 3oz, 4oz thick) are bonded under calibrated pressure and temperature profiles.

This mode of fabrication avoids such typical faults as resin hunger and copper foil wrinkling. This results in a laminate substrate that can withstand lead-free soldering temperatures greater than 260°C without delamination.

Technical Specifications and Standards Compliance

Parameter	Specification
Brand	JingHong
Base Material	E-glass fabric + electrolytic copper foil
Thickness Range	0.2mm – 3.2mm
Standard Dimensions	1040mm × 1240mm
Copper Layer Options	1 oz (35µm), 2 oz, 3 oz, 4 oz
Flame Rating	UL94 V-0
Moisture Absorption	<0.15% (24hr immersion)
Annual Production Capacity	43,000 tons
Minimum Order Quantity	500 kg
Payment Terms	T/T

All products meet ISO9001, ISO14001, and ISO45001 certifications. SGS RoHS compliance testing confirms your laminates are free from restricted substances, making them suitable for global electronics markets.

Versatile Application Across Multiple Industries

Double sided copper clad laminates are the base substrates for the construction of multilayer PCBS for consumer electronics, automotive and industrial control equipments. The distribution of copper is balanced on both sides, allowing for sophisticated routing of circuits.

Its steady dielectric constant makes the material useful for high frequency applications. Laminates for RF communications devices and microwave circuits need to be able to preserve the signal integrity throughout a wide frequency spectrum. Our processing controls guarantee uniform electrical property in each production batch.

Automotive electronics need materials that can tolerate temperature cycling and vibration. The glass-epoxy matrix contributes the mechanical strength required to suppress board flexure during vehicle operation. High-Tg grades are resistant to softening at the high temperatures of the engine compartment.

Reliable Manufacturing Infrastructure

We operate two facilities with legacy expertise and modern automation. The original Hongda Insulation Materials Factory is built for high-volume production, while the new 66,667-square-meter facility is equipped with precise equipment for FR4 grades.

200 million CNY invested in thermal compression systems for process repeatability. Vertical resin coating machines are used to coat uniform layers of binder onto glass cloth before lamination. This dedicated equipment eliminates the cross-contamination problems that plague multi-product plants.

Quality assurance processes include dimensional tolerance verification, solder float testing and dielectric strength measurement. Insulation integrity is verified before shipment. Every production lot is tested in accordance with ASTM D149 Hi-Pot standards.

Machining Considerations and Processing Guidelines

Special tooling is required due to the abrasive nature of the glass fibre reinforcing. Diamond coated router bits and solid carbide drills help reduce premature tool wear in PCB fabrication. Standard high speed steel tools dull quickly with edge chipping.

When choosing the drilling parameters, the thermal qualities of the laminate must be taken into account. Excessive spindle speeds generate heat that can weaken the epoxy resin, resulting in drill wander and hole quality difficulties. Tight tolerances are maintained by controlled feed rates and tool inspection.

When designing board layouts, allow adequate clearance between copper traces and board edges. The Fr4 Copper Clad Laminate Sheet substrate expands minimally during reflow soldering, but proper design margins prevent edge delamination.

Stability and Long-Term Performance

Moisture resistance safeguards the integrity of the circuit in humid conditions. Absorption rates are less than 0.15% therefore dimensional changes are insignificant even after longer exposure times. This stability eliminates the trace-to-trace shorting that is typical with hygroscopic materials.

Bromine based additives in epoxy resin system for the UL94 V-0 criterion on flame retardancy. If it does catch fire, the material will self-extinguish within seconds, preventing the fire from spreading thru the densely packed electronic assembly.

The glass transition temperature (Tg) defines limits of performance at high temperature . Standard grades are structurally sound up to 130°C , and High-Tg grades allow for increases in operating range of more than 170°C in lead-free assembly procedures.

FAQ

Q: Are copper-clad laminates flame-retardant?

A: Yes, FR-4 designation indicates flame retardant properties. According to UL standards (UL 94, UL 746E), rigid CCL products are classified into four categories: UL-94 V0, UL-94 V1, UL-94 V2, and UL-94 HB. Our product meets the most stringent V-0 rating for self-extinguishing performance.

Q: What is the range of your copper layer thickness?

A: Common copper layer thicknesses include 1 oz, 2 oz, 3 oz, and 4 oz, with 1 oz being the most widely used. The "1 oz" designation refers to one ounce of copper per square foot of surface area, which equals approximately 35 micrometers thickness. Different thicknesses affect current-carrying capacity and circuit board stability.

Q: What are the differences between single-sided and double-sided laminates?

A: Single-sided copper-clad laminates feature copper foil on one surface only, suitable for basic circuit designs. Double-sided laminates have copper on both surfaces, enabling more complex routing and higher component density. Your application requirements determine the appropriate configuration.

Q: Can this material withstand automotive temperature cycling?

A: Standard FR-4 performs reliably in most automotive applications. For engine compartment installations or high-power electronics, High-Tg variants provide enhanced thermal stability during prolonged exposure above 130°C. Consult your assembly temperature profiles when selecting grades.

Q: How should I store unused laminate sheets?

A: Store sheets vertically in climate-controlled environments between 15-25°C with relative humidity below 60%. Protect surfaces from dust and mechanical damage. Proper storage maintains processing characteristics and prevents moisture absorption before fabrication.

Contact Us for Technical Support

Ready to source reliable substrate materials for your next PCB project? Contact us at info@jhd-material.com for Fr4 Copper Clad Laminate Sheet samples and quotations.