Fr4 Double-sided CCL

Brand: JingHong
Materials: E-glass fabric + copper foil
Thickness: 0.2mm --- 3.2mm
Regular Size: 1040mm*1240mm
Packaging: Regular packing, Protect by Pallet
Productivity: 43000 Tons per year
Transportation: Ocean, Land, Air
Payment:T/T
MOQ:500KG

  • Fast Delievery
  • Quality Assurance
  • 24/7 Customer Service

Product Introduction

Fr4 Double-sided CCL: High-Performance Copper Clad Laminate for Professional PCB Manufacturing

J&Q New Composite Materials Company is a manufacturer of precise Fr4 Double-sided CCL for enterprise. JingHong brand has two modern production bases, encompassing a total area of 96,667 square meters and with an annual capacity of 43,000 tonnes. Each product is made of E-glass fabric with copper foil attached to both surfaces, and comes in thicknesses ranging from 0.2mm to 3.2mm. Our vertical glue application equipment and state of the art thermal compressors provide reliable dielectric characteristics and excellent copper adhesion. Our Certified products are ISO9001, ISO14001, ISO45001, SGS RoHS, CEMT standards, and meet the most rigorous quality benchmarks of the electronics industry.

Fr4 Double-sided CCL

What Makes Fr4 Double-sided CCL Essential for Your Projects?

This product is the industry standard for the manufacture of printed circuit boards. This composite material, a mixture of continuous filament glass cloth and flame retardant epoxy resin, offers a strong foundation for addressing some of the key manufacturing issues.

The double-sided copper covering gives instant benefits to circuit designers. You may route traces on both surfaces, which drastically reduces board size and manufacturing costs. The copper layers are normally 18μm to 70μm thick and are good conductors to distribute electricity and transmit signals.

Our material is UL94 V-0 flame rated and will self-extinguish within 10 seconds of flame exposure. This important safety feature plays a vital role in safeguarding your end products against fire propagation hazards in consumer electronics, industrial equipment and automotive applications.

The epoxy resin matrix gives excellent dimensional stability. Our Fr4 will not grow out of tight tolerances during soldering operations as it does with phenolic alternatives due to thermal stress.

Fr4 Double-sided CCL

Technical Specifications

Parameter Specification
Brand JingHong
Base Material E-glass fabric + Epoxy Resin
Copper Configuration Double-sided
Thickness Range 0.2mm - 3.2mm
Standard Sheet Size 1040mm × 1240mm
Density ~1.85 g/cm³
Glass Transition Temp (Tg) 130°C - 140°C (Standard) / 170°C+ (High Tg)
Water Absorption <0.1% (24 hours)
Dielectric Strength >50 kV/mm
Dielectric Constant (Dk) ~4.4 @ 1MHz
Flame Rating UL94 V-0
Annual Production Capacity 43,000 Tons
MOQ 500 KG
Payment Terms T/T

Superior Quality Control Process

The reproducibility of the material qualities is essential for the reliability of your manufacturing. There are strict inspection procedures at all the stages of manufacturing.

Our automated scanning systems detect surface flaws including delamination, blistering and resin hunger before goods reach your site. Such deficiencies can result in catastrophic high voltage failures of completed assemblies.

Dimensional inspection under IPC-4101 norms. We have a homogeneity of thickness of ±0.05mm and very tight control of bow and twist metrics. This same manufacturing assures interoperability with automated pick-and-place equipment and prevents solder bridging problems.

Each batch of manufacture is subjected to flammability tests. UL94 V-0 compliance is confirmed by direct flame application and safeguards your products and brand image from self-extinguishing behaviour.

Electrical Safety Testing is breakdown voltage measurement per ASTM D149 and Comparative Tracking Index (CTI) evaluation. These tests verify the integrity of the insulation under operating stress situations.

Simulation models for thermal stress in lead free soldering conditions. Our laminates have been proven to survive several reflows without delamination using solder float testing at 288°C.

Fr4 Double-sided CCL

Key Performance Advantages

We use dual copper clad laminates that offer instant fabrication benefits. Both sides are pre-treated for maximum photoresist adherence to speed your production schedule.

Our excellent strength to weight ratio (density 1.85 g/cm3) minimises shipping costs while retaining structural integrity. The material can be drilled and routed by mechanical means without delamination or fibre tear-out.

Moisture resistance is still crucial to long-term reliability. Our laminates have a water absorption of less than 0.1% and thus also reliable electrical qualities in humid situations. This prevents the growth of Conductive Anodic Filament (CAF) which leads to unexpected short circuit.

Thermal Performance Limits Glass transition temperature. Our standard grade has dimensional stability to 140°C continuous use. High-Tg variations increase this range above 170°C for automotive and industrial applications where compliance with lead-free soldering is required.

Low dielectric loss (dissipation factor) preserves signal integrity in Fr4 Double-sided CCL high-frequency circuits. Your RF designs and high-speed digital applications benefit from consistent impedance control across the substrate.

Fr4 Double-sided CCL

Diverse Application Environments

Our laminates are used by consumer electronics makers for smart phones, tablets and wearable devices. The material offers narrow profile possibilities down to 0.2mm, enabling compact device designs without compromising electrical performance.

Industrial control systems need to be reliable in the long run. These boards are flame retardant and have low moisture absorption providing ideal properties for factory automation, robotics and process control devices used in harsh situations.

Automotive electronics materials have to resist high temperature cycling. High-Tg variations can endure underhood temperatures and maintain structural integrity over years of thermal stress.

LED applications benefit from good thermal conductivity. The copper layers efficiently conduct heat away from the power components, extending the LED lifespan and ensuring steady light output.

Our approved materials are chosen by medical equipment manufacturers for diagnostic instruments and patient monitoring systems. The worldwide safety standards compliance ensures the regulatory certification in the global markets.

Packaging and Logistics

We professionally package your investment to secure it. Each sheet is wrapped in moisture barrier before pallet stacking. Damage during transport by sea, land or air is prevented with corner protectors and stretch film.

Standard pallet sizes allow you to maximise containers and save your freight expenses. To assist your entering quality control systems we include material certifications and test results with every shipment.

Fr4 Double-sided CCL

FAQ

Q: What distinguishes Standard Fr4 from High Tg variants in practical applications?

A: Standard Fr4 (Tg ~130°C) suits most commercial electronics with conventional soldering. High Tg Fr4 (>170°C) prevents Z-axis expansion and copper barrel cracking in multilayer boards during lead-free soldering processes required for RoHS compliance.

Q: Does your product contain halogenated flame retardants?

A: Our traditional formulation uses bromine-based flame retardants meeting UL94 V-0 standards. We also offer halogen-free alternatives using phosphorus compounds for customers requiring REACH and RoHS compliance with reduced toxic smoke generation.

Q: How should fabricators approach machining these laminates?

A: The glass fiber content requires carbide or diamond-tipped tooling to prevent rapid wear. Implement dust extraction systems as fiberglass particles present respiratory hazards and can contaminate sensitive electronics manufacturing environments.

Q: What continuous operating temperature should designers specify?

A: While Tg indicates the softening threshold, specify 130°C-140°C maximum continuous operation for standard grades. Prolonged exposure above this range degrades the epoxy matrix, causing discoloration and mechanical embrittlement.

Q: How does copper adhesion perform under thermal stress?

A: Our copper foil bonding withstands 288°C solder float testing without delamination. The peel strength exceeds industry standards, ensuring reliable plated-through-hole integrity across multiple thermal cycles.

Contact Us for Technical Support

Reach out to info@jhd-material.com for Fr4 Double-sided CCL samples, technical datasheets, or production partnership inquiries.

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